TSMC plans 3%-6% wafer price increase starting January 2027 with stronger hikes for advanced processes

Taiwan Semiconductor announced plans to raise foundry wafer prices by 3% to 6% beginning January 2027, with steeper increases applied to its most advanced manufacturing nodes. The price adjustments reflect intense demand that now stretches into 2030, driven by AI chips, data-center equipment, and specialized power-management components. Mature-node capacity is also tightening, with legacy 8-inch fabs reportedly running above full utilization and leading-edge processes fully loaded. Analyst commentary suggests the supply shortfall for AI accelerators and custom chips will persist through 2030, extending TSMC's pricing advantage well beyond prior industry expectations.

1. TSMC plans 3%-6% price increases on wafer foundry services starting January 2027, with larger hikes for advanced nodes, according to DigiTimes report dated September 24, 2026
2. Company's demand visibility now extends to 2030 according to the report
3. TSMC's 8-inch fabs operating above 100% utilization; 45nm and below processes fully loaded
4. Price increases driven by AI components including power-management chips and advanced packaging for optical communications
5. CLSA analyst Bhavtosh Vajpayee says demand for GPUs and custom AI chips exceeds supply by roughly 73% and shortage expected to persist until about 2030