TSMC expands advanced packaging capacity with new Taiwan facility

Taiwan Semiconductor marked September 21, 2026 with a groundbreaking ceremony for Baipu Industrial Park in Kaohsiung, Taiwan. The dual-purpose facility will serve two critical functions: validating advanced packaging technologies and training skilled workers for next-generation manufacturing roles. Late 2029 marks the targeted launch date for this site. As TSMC juggles construction on roughly 20 plants across Taiwan and the globe to satisfy explosive demand for AI processors, this southern Taiwan investment bolsters the regional chip manufacturing base and positions the company to meet customer demand for more sophisticated packaging solutions that enhance chip performance and integration efficiency.

1. TSMC broke ground on Baipu Industrial Park in Kaohsiung, Taiwan on September 21, 2026
2. The park will house two facilities dedicated to technology validation and workforce development
3. The facility is scheduled to become operational in the fourth quarter of 2029
4. Baipu Industrial Park strengthens Taiwan's broader semiconductor manufacturing footprint in the southern region
5. TSMC is simultaneously building approximately 20 factories in Taiwan and internationally to address AI chip demand